Цена по запросу
1-1814655-5, Панелька SIP, PIN 20, 2,54мм, THT, Покрытие gold flash
Полупроводники\Оснащение для полупроводников\Подставки DIP стандартные Описание Панелька SIP, PIN 20, 2,54мм, THT, Покрытие gold flash
Другие названия товара № | 1-1814655-5 |
Категория продукта | Установочные панели для ИС и компонентов |
Подкатегория | IC Component Sockets |
Размер фабричной упаковки | 1000 |
Тип продукта | IC Component Sockets |
Торговая марка | TE Connectivity |
Упаковка | Bulk |
Contact Finish - Mating | Gold |
Contact Finish - Post | Tin |
Contact Finish Thickness - Mating | Flash |
Contact Finish Thickness - Post | 196.9Вµin (5.00Вµm) |
Contact Material - Mating | Beryllium Copper |
Contact Material - Post | Brass |
Contact Resistance | 10mOhm |
ECCN | EAR99 |
Features | Closed Frame |
Housing Material | Thermoplastic, Polyester |
HTSUS | 8536.69.4040 |
Material Flammability Rating | UL94 V-0 |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Mounting Type | Through Hole |
Number of Positions or Pins (Grid) | 20 (1 x 20) |
Operating Temperature | -55В°C ~ 125В°C |
Package | Bulk |
Pitch - Mating | 0.100"" (2.54mm) |
Pitch - Post | 0.100"" (2.54mm) |
RoHS Status | RoHS Compliant |
Termination | Solder |
Termination Post Length | 0.114"" (2.90mm) |
Type | SIP |
Contact Material | Beryllium Copper |
Contact Plating | Gold |
Current Rating | 1A |
Maximum Operating Temperature | +125°C |
Minimum Operating Temperature | -55°C |
Number of Contacts | 20 |
Orientation | Straight |
Pitch | 2.54mm |
Termination Method | Solder |
Width | 4.4mm |
Вес, г | 1.1 |