Как мы работаем
По сертификату
"военный регистр"
"военный регистр"
Только с Юр. Лицами,
мелкий и крупный опт
мелкий и крупный опт
Цена по запросу
470-3155-600, Board to Board & Mezzanine Connectors 300P NeXLev Recept Solder Balls
Connectors\Board to Board & Mezzanine ConnectorsNeXLev® Parallel Board-to-Board Connectors Amphenol TCS NeXLev® product line features High-Density Parallel Board-to-Board Connectors capable of handling data rates up to 12.5Gbps. Developed to meet the increasing bandwidth requirements in mezzanine applications, NeXLev enables design engineers to relocate high pin count devices onto a mezzanine or module card to simplify board routing and optimize system performance.
| Brand | Amphenol TCS |
| Contact Material | Copper Alloy |
| Contact Plating | Gold |
| Current Rating | 1 A |
| Data Rate | 12.5 Gbps |
| Factory Pack Quantity | 20 |
| Housing Material | Liquid Crystal Polymer(LCP) |
| Manufacturer | Amphenol |
| Maximum Data Rate | 12.5 Gbps |
| Maximum Operating Temperature | +105 C |
| Minimum Operating Temperature | -40 C |
| Mounting Angle | Vertical |
| Number of Positions | 300 Position |
| Number of Rows | 30 Row |
| Packaging | Tray |
| Pitch | 1.15 mm(0.045 in) |
| Product Category | Board to Board & Mezzanine Connectors |
| Product Type | Board to Board & Mezzanine Connectors |
| Product | Receptacles |
| Stack Height | 18 mm, 20 mm, 22 mm, 25 mm |
| Subcategory | Board to Board & Mezzanine Connectors |
| Termination Style | BGA |
| Voltage Rating | 600 V |
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