Как мы работаем
По сертификату
"военный регистр"
"военный регистр"
Только с Юр. Лицами,
мелкий и крупный опт
мелкий и крупный опт
Цена по запросу
A17751-08, Thermal Interface Products Tflex HD92000 18x18
Thermal Management\Thermal Interface ProductsTflex™ HD90000 Thermal Gap Filler Laird Performance Materials Tflex™ HD90000 Thermal Gap Filler features a combination of 7.5W/mK thermal conductivity with superior pressure vs. deflection characteristics. This silicone-based thermal gap filler minimizes board and component stress. The ceramic-filled silicon sheets are offered in a variety of thicknesses ranging from 0.020" to 0.200". Laird Performance Materials Tflex™ HD90000 Thermal Gap Filler is an environmentally friendly solution that meets regulatory requirements, including RoHS and REACH.
| Brand | Laird Performance Materials |
| Color | Gray |
| Factory Pack Quantity | 1 |
| Flammability Rating | UL 94 V-0 |
| Manufacturer | Laird Performance Materials |
| Material | Ceramic Filled Silicone |
| Maximum Operating Temperature | +125 C |
| Minimum Operating Temperature | -50 C |
| Packaging | Bulk |
| Product Category | Thermal Interface Products |
| Product Type | Thermal Interface Products |
| Product | Thermally Conductive Gap Pad |
| Subcategory | Thermal Management |
| Tensile Strength | 10 psi |
| Thermal Conductivity | 7.5 W/m-K |
| Thickness | 2.03 mm |
| Type | Thermal Pad |
