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FS660R08A6P2FLBBPSA1, IGBT Modules N

Semiconductors\Discrete Semiconductors\Transistors\IGBT ModulesAutomotive HybridPACK™ IGBT Modules Infineon Technologies Automotive HybridPACK™ IGBT Modules extend across the full power spectrum required in electric and hybrid electric vehicles (EVs/HEVs). These compact modules are available in six RoHS-compliant versions with three base plate options: copper, direct cooled with ribbon bonds, and direct cooled with pin fins. The modules offer an integrated NTC temperature sensor, PressFIT contact technology, and guiding elements for easy PCB and cooler assembly. Other features include high creepage and clearance distances, high power density, and low switching losses. Applications for Infineon Automotive HybridPACK IGBT Modules include EVs, HEVs, motor drives, and commercial agriculture vehicles.

Brand	Infineon Technologies
Collector- Emitter Voltage VCEO Max	750 V
Collector-Emitter Saturation Voltage	1.1 V
Configuration	6-Pack
Continuous Collector Current at 25 C	450 A
Factory Pack Quantity	6
Gate-Emitter Leakage Current	400 nA
Manufacturer	Infineon
Maximum Gate Emitter Voltage	20 V
Maximum Operating Temperature	+150 C
Minimum Operating Temperature	-40 C
Mounting Style	Screw Mount
Packaging	Tray
Part # Aliases	FS660R08A6P2FLB SP001850450
Product Category	IGBT Modules
Product Type	IGBT Modules
Product	Hybrid IGBT Modules
Subcategory	IGBTs
Technology	Si
Вес, г	600