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GP2202SF-0.010-01-0918, Thermal Interface Products GAP PAD, Conductive, Sil-Free, 9"x18" Sheet, 0.010" Thickness, 1 Side Tack
Thermal Management\Thermal Interface ProductsTGP 2202SF Silicone-Free GAP PAD®
Bergquist TGP 2202SF Silicone-Free GAP PAD® are high-performance, 2.0W/m-K, thermally conductive gap filling material that is silicone-free by design and offers exceptionally low interfacial resistances to adjacent surfaces. The gap pads are specifically designed for silicone-sensitive applications. The material"s construction features a 0.5mil PET film on one side and a natural tack on the other. The natural tack eliminates the need for an additional adhesive layer. The Bergquist TGP 2202SF Silicone-Free GAP PAD® are available in sheet form and are gray in appearance. Typical thermal management applications include hard drives, set-top boxes, and optical applications.
| Brand | Bergquist Company |
| Color | Gray |
| Designed for | Silicone Sensitive Applications |
| Factory Pack Quantity: Factory Pack Quantity | 1 |
| Flammability Rating | UL 94 V-0 |
| Manufacturer | Bergquist Company |
| Material | Silicone-Free Metal Oxide |
| Maximum Operating Temperature | +125 C |
| Minimum Operating Temperature | -40 C |
| Part # Aliases | BG425304.01 2190969 |
| Product Category | Thermal Interface Products |
| Product Type | Thermal Interface Products |
| Product | Thermally Conductive Gap Pad |
| Series | 2202SF/TGP 2202SF |
| Subcategory | Thermal Management |
| Thermal Conductivity | 2 W/m-K |
| Thickness | 0.254 mm |
| Tradename | GAP PAD |
| Type | Thermal Pad |
