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GPHC5.0-0.100-02-0816, Thermal Interface Products GAP PAD, S-Class, 8"x16" Sheet, 0.100" Thickness, TGPHC5000/HC 5.0
Thermal Management\Thermal Interface ProductsTGP HC5000 Highly Conformable GAP PAD® Bergquist Company TGP HC5000 Highly Conformable GAP PAD® is a silicon-based 5.0 W/m-K high compliance GAP PAD that is non-electrically conductive and highly conformable. The HC5.0 GAP PAD is available in various thicknesses and custom part sizes and features low hardness and modules. The thermal interface is tacky on one side with a clear PET liner with reduced tack on one side and Blue Diamond liner. Bergquist Company TGP HC5000 Highly Conformable GAP PAD is easily reworkable.
| Brand | Bergquist Company |
| Breakdown Voltage | 5 kVAC |
| Color | Violet |
| Factory Pack Quantity | 1 |
| Flammability Rating | UL 94 V-0 |
| Manufacturer | Bergquist Company |
| Material | Silicone Elastomer |
| Maximum Operating Temperature | +200 C |
| Minimum Operating Temperature | -60 C |
| Part # Aliases | L16INW8INH0.1 SH PN0008400 L16INW8INH0D0 2168237 |
| Product Category | Thermal Interface Products |
| Product Type | Thermal Interface Products |
| Product | Thermally Conductive Gap Pad |
| Subcategory | Thermal Management |
| Tensile Strength | 17.5 psi |
| Thermal Conductivity | 5 W/m-K |
| Thickness | 2.54 mm |
| Type | Thermal Pad |
| Вес, кг | 1 |
