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Цена по запросу
PL-05-3-1016-H, Thermal Interface Products ulTIMiFlux Gap Pad, Silicone, 0.5mm Thick, 3 W/m-K, 101.6x101.6mm, Hyper Soft
Thermal Management\Thermal Interface ProductsThermal Gap Filling Pads Wakefield-Vette ulTIMiFlux Thermal Gap Filling Pads are designed to fill large voids between a device and the heat sink. A variety of sizes, thicknesses, conductivities, and durometers to configure a custom thermal solution.
| Brand | Wakefield-Vette |
| Breakdown Voltage | 5 kVAC |
| Color | Green |
| Designed for | Filling Void between Devices |
| Factory Pack Quantity | 250 |
| Flammability Rating | UL 94 V-0 |
| Manufacturer | Wakefield-Vette |
| Material | Silicone Elastomer |
| Maximum Operating Temperature | +200 C |
| Minimum Operating Temperature | -60 C |
| Product Category | Thermal Interface Products |
| Product Type | Thermal Interface Products |
| Product | Thermally Conductive Gap Pad |
| Subcategory | Thermal Management |
| Thermal Conductivity | 3 W/m-K |
| Thickness | 0.5 mm |
| Type | Thermal Pad |
| Линейка Продукции | ulTIMiFlux Series |
| Проводящий Материал | Silicone |
| Теплопроводность | 3Вт/м.K |
| Толщина | 0.5мм |
