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PL-2-5-254-H, Thermal Interface Products ulTIMiFlux Gap Pad, Silicone, 2mm Thickness, 5 W/m-K, 25.4x25.4mm, Hyper Soft
Thermal Management\Thermal Interface ProductsThermal Gap Filling Pads
Wakefield-Vette ulTIMiFlux Thermal Gap Filling Pads are designed to fill large voids between a device and the heat sink. A variety of sizes, thicknesses, conductivities, and durometers to configure a custom thermal solution.
Brand | Wakefield-Vette |
Breakdown Voltage | 5 kVAC |
Color | Gold |
Designed for | Filling Void between Devices |
Factory Pack Quantity: Factory Pack Quantity | 250 |
Flammability Rating | UL 94 V-0 |
Manufacturer | Wakefield-Vette |
Material | Silicone Elastomer |
Maximum Operating Temperature | +200 C |
Minimum Operating Temperature | -60 C |
Product Category | Thermal Interface Products |
Product Type | Thermal Interface Products |
Product | Thermally Conductive Gap Pad |
Series | PL |
Subcategory | Thermal Management |
Thermal Conductivity | 5 W/m-K |
Thickness | 2 mm |
Tradename | ulTIMiFlux |
Type | Thermal Pad |