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Q3-0.005-00-58, Thermal Interface Products Grease TI, 0.005" Thickness, 0.750x0.500x0.187x0.125", Sil-Pad TSPQ2000/Q-Pad 3
Thermal Management\Thermal Interface ProductsThermal SIL PAD® Materials Bergquist Company Thermal SIL PAD® Materials are electrically and non-electrically insulating silicone thermal interface materials. These materials minimize thermal resistance from the external package of a power semiconductor to the heat sink. This is achieved by isolating the semiconductor electrically from the heat sink and providing sufficient dielectric strength to withstand high voltage. The SIL PAD® materials are made of conformable fiberglass and silicone rubber, which provides a more versatile material than mica or ceramics and grease. These materials are designed to be clean, grease-free, and flexible.
| Brand | Bergquist Company |
| Color | Black |
| Factory Pack Quantity | 1 |
| Flammability Rating | UL 94 V-0 |
| Manufacturer | Bergquist Company |
| Material | Silicone Elastomer |
| Maximum Operating Temperature | +180 C |
| Minimum Operating Temperature | -60 C |
| Part # Aliases | BG426799 L0.75INW0.5INH0.005 2191239 |
| Product Category | Thermal Interface Products |
| Product Type | Thermal Interface Products |
| Product | Thermally Conductive Insulator |
| Subcategory | Thermal Management |
| Tensile Strength | 50 psi |
| Thermal Conductivity | 2 W/m-K |
| Thickness | 0.127 mm |
| Type | Q-Pad Grease Replacement Thermal Interface |
| Backing, Carrier | Fiberglass |
| Material | Elastomer |
| Outline | 19.05mm x 12.70mm |
| Shape | Rectangular |
| Thermal Conductivity | 2.0W/m-K |
| Thermal Resistivity | 0.35°C/W |
| Thickness | 0.0050"(0.127mm) |
| Type | Pad, Sheet |
| Usage | TO-220 |
