Как мы работаем
По сертификату
"военный регистр"
"военный регистр"
Только с Юр. Лицами,
мелкий и крупный опт
мелкий и крупный опт
Цена по запросу
SMDLTLFP250T4, Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 8.8 oz (250g)
Soldering, Desoldering, Rework Products\SolderБессвинцовая паяльная паста Bi57.6Sn42Ag0,4 (57,6 / 42 / 0,4), не требующая очистки, банка, 8,8 унций (250 г)
| Composition | Bi57.6Sn42Ag0.4 (57.6/42/0.4) |
| Digi-Key Storage | Refrigerated |
| ECCN | EAR99 |
| Flux Type | No-Clean |
| Form | Jar, 8.8 oz (250g) |
| HTSUS | 3810.10.0000 |
| Melting Point | 281В°F (138В°C) |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Package | Jar |
| Process | Lead Free |
| REACH Status | REACH Unaffected |
| RoHS Status | ROHS3 Compliant |
| Shelf Life | 6 Months |
| Shelf Life Start | Date of Manufacture |
| Shipping Info | Ships with Cold Pack. To ensure customer satisfact |
| Storage/Refrigeration Temperature | 37В°F ~ 46В°F (3В°C ~ 8В°C) |
| Type | Solder Paste |
