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Только с Юр. Лицами,
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Цена по запросу
SMDLTLFP60T4, Lead Free No-Clean Solder Paste, Two Part Mix Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 2.12 oz (60g)
Soldering, Desoldering, Rework Products\SolderБессвинцовая паяльная паста, не требующая очистки, двухкомпонентная смесь Bi57.6Sn42Ag0,4 (57,6 / 42 / 0,4) банка, 2,12 унции (60 г)
| Composition | Bi57.6Sn42Ag0.4 (57.6/42/0.4) |
| ECCN | EAR99 |
| Flux Type | No-Clean |
| Form | Jar, 2.12 oz (60g) |
| HTSUS | 8311.30.6000 |
| Melting Point | 281В°F (138В°C) |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Package | Bulk |
| Process | Lead Free |
| REACH Status | REACH Unaffected |
| RoHS Status | ROHS3 Compliant |
| Shelf Life | 24 Months |
| Shelf Life Start | Date of Manufacture |
| Storage/Refrigeration Temperature | 37В°F ~ 77В°F (3В°C ~ 25В°C) |
| Type | Solder Paste, Two Part Mix |
| Video File | Chip Quik’s - Patent Pending Two-Part Mix Solder |
