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SP1000-0.009-00-103, Thermal Interface Products Sil-Pad, 0.009" Thickness, No Adhesive, 0.75x0.8", 0.16" Diameter Hole
Thermal Management\Thermal Interface ProductsThermal SIL PAD® Materials Bergquist Company Thermal SIL PAD® Materials are electrically and non-electrically insulating silicone thermal interface materials. These materials minimize thermal resistance from the external package of a power semiconductor to the heat sink. This is achieved by isolating the semiconductor electrically from the heat sink and providing sufficient dielectric strength to withstand high voltage. The SIL PAD® materials are made of conformable fiberglass and silicone rubber, which provides a more versatile material than mica or ceramics and grease. These materials are designed to be clean, grease-free, and flexible.
| Brand | Bergquist Company |
| Breakdown Voltage | 4.5 kVAC |
| Color | Pink |
| Factory Pack Quantity | 1 |
| Manufacturer | Bergquist Company |
| Material | Silicone Elastomer |
| Maximum Operating Temperature | +180 C |
| Minimum Operating Temperature | -60 C |
| Part # Aliases | 1009-03 2545924 |
| Product Category | Thermal Interface Products |
| Product Type | Thermal Interface Products |
| Product | Thermally Conductive Insulator |
| Subcategory | Thermal Management |
| Tensile Strength | 30 MPa |
| Thermal Conductivity | 1.2 W/m-K |
| Thermal Resistance | 0.35 C/W |
| Thickness | 0.23 mm |
| Type | Thermal Pad |
| Вес, г | 0.65 |
