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Цена по запросу
SP2000-0.015-AC-54, Thermal Interface Products Sil-Pad, 0.75 Inch x 0.5 Inch, 0.015" Thickness, 1 Side Adhesive, TSP3500/2000
Thermal Management\Thermal Interface ProductsThermal SIL PAD® Materials Bergquist Company Thermal SIL PAD® Materials are electrically and non-electrically insulating silicone thermal interface materials. These materials minimize thermal resistance from the external package of a power semiconductor to the heat sink. This is achieved by isolating the semiconductor electrically from the heat sink and providing sufficient dielectric strength to withstand high voltage. The SIL PAD® materials are made of conformable fiberglass and silicone rubber, which provides a more versatile material than mica or ceramics and grease. These materials are designed to be clean, grease-free, and flexible.
| Brand | Bergquist Company |
| Breakdown Voltage | 4 kVAC |
| Color | White |
| Factory Pack Quantity | 135 |
| Flammability Rating | UL 94 V-0 |
| Manufacturer | Bergquist Company |
| Material | Silicone |
| Maximum Operating Temperature | +200 C |
| Minimum Operating Temperature | -60 C |
| Part # Aliases | 21898992192459 |
| Product Category | Thermal Interface Products |
| Product Type | Thermal Interface Products |
| Product | Thermally Conductive Insulator |
| Subcategory | Thermal Management |
| Thermal Conductivity | 3.5 W/m-K |
| Thickness | 0.015 in |
| Type | Thermally Conductive Adhesive |
