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SP400-0.007-AC-54, Thermal Interface Products Sil-Pad, Dimensions: 19.05x12.70mm, Sil-Pad TSP900/400, IDH 2167707
Thermal Management\Thermal Interface ProductsThermal SIL PAD® Materials
Bergquist Company Thermal SIL PAD ® Materials are electrically and non-electrically insulating silicone thermal interface materials. These materials minimize thermal resistance from the external package of a power semiconductor to the heat sink. This is achieved by isolating the semiconductor electrically from the heat sink and providing sufficient dielectric strength to withstand high voltage. The SIL PAD ® materials are made of conformable fiberglass and silicone rubber, which provides a more versatile material than mica or ceramics and grease. These materials are designed to be clean, grease-free, and flexible.
| Brand | Bergquist Company |
| Breakdown Voltage | 3.5 kVAC |
| Color | Gray |
| Factory Pack Quantity: Factory Pack Quantity | 100 |
| Flammability Rating | UL 94 V-0 |
| Manufacturer | Bergquist Company |
| Material | Silicone Elastomer |
| Maximum Operating Temperature | +180 C |
| Minimum Operating Temperature | -60 C |
| Part # Aliases | BG426843 3223-07AC-54 2191259 2167707 |
| Product Category | Thermal Interface Products |
| Product Type | Thermal Interface Products |
| Product | Thermally Conductive Insulator |
| Series | 400/TSP 900 |
| Subcategory | Thermal Management |
| Tensile Strength | 20 MPa |
| Thermal Conductivity | 0.9 W/m-K |
| Thickness | 0.178 mm |
| Tradename | Sil-Pad |
| Type | Thermal Pad |
| Hardness | Shore A 85 |
| Material | Fibreglass |
| Material Trade Name | Sil-Pad 400 |
| Maximum Operating Temperature | +180°C |
| Minimum Operating Temperature | -60°C |
| Operating Temperature Range | -60 →+180 °C |
| Self-Adhesive | Yes |
| Thermal Conductivity | 0.9W/m·K |
| Thickness | 0.178mm |
| Width | 12.7mm |
| Вес, г | 0.16 |
