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SP400-0.009-00-23, Thermal Interface Products Sil-Pad, 0.009" Thickness, TSP900/400, 7403-09FR-23, BG95121, IDH 2192653
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SP400-0.009-00-23, Thermal Interface Products Sil-Pad, 0.009" Thickness, TSP900/400, 7403-09FR-23, BG95121, IDH 2192653

Thermal Management\Thermal Interface ProductsThermal SIL PAD® Materials Bergquist Company Thermal SIL PAD® Materials are electrically and non-electrically insulating silicone thermal interface materials. These materials minimize thermal resistance from the external package of a power semiconductor to the heat sink. This is achieved by isolating the semiconductor electrically from the heat sink and providing sufficient dielectric strength to withstand high voltage. The SIL PAD® materials are made of conformable fiberglass and silicone rubber, which provides a more versatile material than mica or ceramics and grease. These materials are designed to be clean, grease-free, and flexible.
Brand Bergquist Company
Breakdown Voltage 3.5 kVAC
Color Gray
Factory Pack Quantity 100
Flammability Rating UL 94 V-0
Manufacturer Bergquist Company
Material Silicone Elastomer
Maximum Operating Temperature +180 C
Minimum Operating Temperature -60 C
Part # Aliases BG95121 7403-09FR-23 2192653
Product Category Thermal Interface Products
Product Type Thermal Interface Products
Product Thermally Conductive Insulator
Subcategory Thermal Management
Tensile Strength 20 MPa
Thermal Conductivity 0.9 W/m-K
Thickness 0.229 mm
Type Thermal Pad
Вес, г 0.38

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