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SP900S-0.009-AC-104, Thermal Interface Products Sil-Pad, Low-Pressure, 0.009" Thickness, 1 Side Adhesive, TSP1600S/900S
Thermal Management\Thermal Interface ProductsThermal SIL PAD® Materials
Bergquist Company Thermal SIL PAD ® Materials are electrically and non-electrically insulating silicone thermal interface materials. These materials minimize thermal resistance from the external package of a power semiconductor to the heat sink. This is achieved by isolating the semiconductor electrically from the heat sink and providing sufficient dielectric strength to withstand high voltage. The SIL PAD ® materials are made of conformable fiberglass and silicone rubber, which provides a more versatile material than mica or ceramics and grease. These materials are designed to be clean, grease-free, and flexible.
| Brand | Bergquist Company |
| Breakdown Voltage | 5.5 kVAC |
| Color | Pink |
| Factory Pack Quantity: Factory Pack Quantity | 100 |
| Flammability Rating | UL 94 0-V |
| Manufacturer | Bergquist Company |
| Material | Silicone Elastomer |
| Maximum Operating Temperature | +180 C |
| Minimum Operating Temperature | -60 C |
| Part # Aliases | BG416811 2189860 |
| Product Category | Thermal Interface Products |
| Product Type | Thermal Interface Products |
| Product | Thermally Conductive Insulator |
| Series | 900S/TSP 1600S |
| Subcategory | Thermal Management |
| Tensile Strength | 9 MPa |
| Thermal Conductivity | 1.6 W/m-K |
| Thickness | 0.229 mm |
| Tradename | Sil-Pad |
| Type | Thermal Pad |
