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SPA2000-0.015-00-58, Thermal Interface Products Insulator, 0.015" Thickness, No Adhesive, 0.750x0.500", Sil-Pad TSPA3000/A2000
Thermal Management\Thermal Interface ProductsThermal SIL PAD® Materials Bergquist Company Thermal SIL PAD® Materials are electrically and non-electrically insulating silicone thermal interface materials. These materials minimize thermal resistance from the external package of a power semiconductor to the heat sink. This is achieved by isolating the semiconductor electrically from the heat sink and providing sufficient dielectric strength to withstand high voltage. The SIL PAD® materials are made of conformable fiberglass and silicone rubber, which provides a more versatile material than mica or ceramics and grease. These materials are designed to be clean, grease-free, and flexible.
| Brand | Bergquist Company |
| Breakdown Voltage | 4 kVAC |
| Color | White |
| Factory Pack Quantity | 1 |
| Flammability Rating | UL 94 V-0 |
| Manufacturer | Bergquist Company |
| Material | Silicone Elastomer |
| Maximum Operating Temperature | +200 C |
| Minimum Operating Temperature | -60 C |
| Packaging | Bulk |
| Part # Aliases | BG426626 L0.75INW0.5INH0.015 2191174 |
| Product Category | Thermal Interface Products |
| Product Type | Thermal Interface Products |
| Product | Thermally Conductive Insulator |
| Subcategory | Thermal Management |
| Tensile Strength | 50 psi |
| Thermal Conductivity | 3 W/m-K |
| Thickness | 0.381 mm |
| Type | Thermal Pad |
| Вес, г | 1 |
