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SPK6-0.006-00-54, Thermal Interface Products Kapton-Based Insulator, 0.006" Thickness, Sil-Pad TSPK1100/K-6, K6-54, BG70054
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SPK6-0.006-00-54, Thermal Interface Products Kapton-Based Insulator, 0.006" Thickness, Sil-Pad TSPK1100/K-6, K6-54, BG70054

Thermal Management\Thermal Interface ProductsThermal SIL PAD® Materials Bergquist Company Thermal SIL PAD ® Materials are electrically and non-electrically insulating silicone thermal interface materials. These materials minimize thermal resistance from the external package of a power semiconductor to the heat sink. This is achieved by isolating the semiconductor electrically from the heat sink and providing sufficient dielectric strength to withstand high voltage. The SIL PAD ® materials are made of conformable fiberglass and silicone rubber, which provides a more versatile material than mica or ceramics and grease. These materials are designed to be clean, grease-free, and flexible.
Brand Bergquist Company
Breakdown Voltage 6 kVAC
Color Blue-Green
Factory Pack Quantity: Factory Pack Quantity 100
Manufacturer Bergquist Company
Material Silicone Elastomer
Maximum Operating Temperature +180 C
Minimum Operating Temperature -60 C
Part # Aliases BG70054 K6-54 2167632
Product Category Thermal Interface Products
Product Type Thermal Interface Products
Product Thermally Conductive Insulator
Series K-6/TSP K1100
Subcategory Thermal Management
Tensile Strength 35 MPa
Thermal Conductivity 1.1 W/m-K
Thickness 0.15 mm
Tradename Sil-Pad
Type Thermal Pad
Hardness Shore A 90
Material Thin Film Polyimide
Material Trade Name Sil-Pad K6
Maximum Operating Temperature +180°C
Minimum Operating Temperature -60°C
Operating Temperature Range -60 →+180 °C
Thermal Conductivity 1.1W/m·K
Thickness 0.152mm
Width 12.7mm