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SPK6-0.006-AC-11.512, Thermal Interface Products Sil-Pad, Kapton-Based, 11.5"x12" Sheet, 0.006" Thickness, 1 Side Adhesive
Thermal Management\Thermal Interface ProductsThermal SIL PAD® Materials
Bergquist Company Thermal SIL PAD ® Materials are electrically and non-electrically insulating silicone thermal interface materials. These materials minimize thermal resistance from the external package of a power semiconductor to the heat sink. This is achieved by isolating the semiconductor electrically from the heat sink and providing sufficient dielectric strength to withstand high voltage. The SIL PAD ® materials are made of conformable fiberglass and silicone rubber, which provides a more versatile material than mica or ceramics and grease. These materials are designed to be clean, grease-free, and flexible.
| Brand | Bergquist Company |
| Breakdown Voltage | 6 kVAC |
| Color | Blue-Green |
| Designed for | To act as dielectric barrier against cut-through |
| Factory Pack Quantity: Factory Pack Quantity | 1 |
| Manufacturer | Bergquist Company |
| Material | Silicone Elastomer |
| Maximum Operating Temperature | +180 C |
| Minimum Operating Temperature | -60 C |
| Product Category | Thermal Interface Products |
| Product Type | Thermal Interface Products |
| Product | Thermally Conductive Insulator |
| Series | K-6/TSP K1100 |
| Subcategory | Thermal Management |
| Tensile Strength | 35 MPa |
| Thermal Conductivity | 1.1 W/m-K |
| Thickness | 0.15 mm |
| Tradename | Sil-Pad |
| Type | Thermal Pad |
| Вес, г | 90.32 |
