Как мы работаем
По сертификату
"военный регистр"
"военный регистр"
Только с Юр. Лицами,
мелкий и крупный опт
мелкий и крупный опт
Цена по запросу
TSP 900-0.007-AC-44, Thermal Interface Products Original Sil-Pad Material, 0.007" Thickness, 1 Side Adhesive, Sil-Pad TSP900/400
Thermal Management\Thermal Interface ProductsThermal SIL PAD® Materials Bergquist Company Thermal SIL PAD® Materials are electrically and non-electrically insulating silicone thermal interface materials. These materials minimize thermal resistance from the external package of a power semiconductor to the heat sink. This is achieved by isolating the semiconductor electrically from the heat sink and providing sufficient dielectric strength to withstand high voltage. The SIL PAD® materials are made of conformable fiberglass and silicone rubber, which provides a more versatile material than mica or ceramics and grease. These materials are designed to be clean, grease-free, and flexible.
| Brand | Bergquist Company |
| Breakdown Voltage | 4.5 kVAC |
| Color | Gray |
| Factory Pack Quantity | 54000 |
| Flammability Rating | UL 94 V-0 |
| Manufacturer | Bergquist Company |
| Material | Silicone |
| Maximum Operating Temperature | +180 C |
| Minimum Operating Temperature | -60 C |
| Part # Aliases | 2805003 |
| Product Category | Thermal Interface Products |
| Product Type | Thermal Interface Products |
| Product | Thermal Management |
| Subcategory | Thermal Management |
| Thermal Conductivity | 0.9 W/m-K |
| Thickness | 0.229 mm |
| Type | Thermal Pad |
