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TT60N16SOF, Thyristor Modules 20mm Solder Bond Thyristor Module

UnclassifiedSolder Bond Power Block IGBT Modules Infineon Solder Bond Power Block IGBT Modules are bipolar power modules that are in a solder bond technology to address the specific requirements of cost-effective applications. These Power Block modules expands its already comprehensive power module portfolio which, so far, was only using pressure contacts. With market prices of approximately 25 percent (depending on module/application) less than related pressure contact variants solder bond modules offer significant cost advantages in modules with smaller packages sizes of up to 50mm. The small solder Power Block modules are ideal for applications like standard drives or UPS, where the high robustness of pressure contacts is not necessarily a must.

Brand	Infineon Technologies
Factory Pack Quantity	12
Gate Trigger Current - Igt	100 mA
Holding Current Ih Max	250 mA
Manufacturer	Infineon
Maximum Operating Temperature	+125 C
Minimum Operating Temperature	-40 C
Mounting Style	Screw Mount
Packaging	Tray
Part # Aliases	SP001272792 TT60N16SOFHPSA1
Product Category	Thyristor Modules
Product Type	Thyristor Modules
Product	Thyristor Modules
Subcategory	Discrete and Power Modules
Technology	Si
Вес, г	75