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BSC039N06NS, DFN-85.1x5.9 MOSFETs ROHS
Infineon offers a large and comprehensive portfolio of MOSFET devices which includes the CoolMOS, OptiMOS and StrongIRFET families.
Channel Mode | Enhancement |
Channel Type | N |
Forward Diode Voltage | 1.2V |
Maximum Continuous Drain Current | 100 A |
Maximum Drain Source Resistance | 5.9 mΩ |
Maximum Drain Source Voltage | 60 V |
Maximum Gate Source Voltage | -20 V, +20 V |
Maximum Operating Temperature | +150 °C |
Maximum Power Dissipation | 69 W |
Minimum Operating Temperature | -55 °C |
Mounting Type | Surface Mount |
Number of Elements per Chip | 1 |
Package Type | TDSON |
Pin Count | 8 |
Series | OptiMOS 5 |
Transistor Configuration | Single |
Transistor Material | Si |
Typical Gate Charge @ Vgs | 27 nC @ 10 V |
Width | 5.35mm |
Automotive | No |
Configuration | Single Quad Drain Triple Source |
ECCN (US) | EAR99 |
EU RoHS | Compliant with Exemption |
Lead Shape | No Lead |
Maximum Continuous Drain Current (A) | 100 |
Maximum Continuous Drain Current on PCB @ TC=25°C (A) | 19 |
Maximum Diode Forward Voltage (V) | 1.2 |
Maximum Drain Source Resistance (mOhm) | 3.9@10V |
Maximum Drain Source Voltage (V) | 60 |
Maximum Gate Resistance (Ohm) | 2.4 |
Maximum Gate Source Leakage Current (nA) | 100 |
Maximum Gate Source Voltage (V) | ±20 |
Maximum Gate Threshold Voltage (V) | 3.3 |
Maximum IDSS (uA) | 1 |
Maximum Junction Ambient Thermal Resistance on PCB (°C/W) | 50 |
Maximum Operating Temperature (°C) | 150 |
Maximum Positive Gate Source Voltage (V) | 20 |
Maximum Power Dissipation (mW) | 2500 |
Maximum Power Dissipation on PCB @ TC=25°C (W) | 2.5 |
Maximum Pulsed Drain Current @ TC=25°C (A) | 400 |
Minimum Gate Threshold Voltage (V) | 2.1 |
Minimum Operating Temperature (°C) | -55 |
Mounting | Surface Mount |
Operating Junction Temperature (°C) | -55 to 150 |
Packaging | Tape and Reel |
Part Status | Active |
PCB changed | 8 |
PPAP | No |
Process Technology | OptiMOS |
Product Category | Power MOSFET |
Standard Package Name | SON |
Supplier Package | TDSON EP |
Typical Diode Forward Voltage (V) | 0.9 |
Typical Fall Time (ns) | 7 |
Typical Gate Charge @ 10V (nC) | 27 |
Typical Gate Charge @ Vgs (nC) | 27@10V |
Typical Gate Plateau Voltage (V) | 4.8 |
Typical Gate Threshold Voltage (V) | 2.8 |
Typical Gate to Drain Charge (nC) | 5 |
Typical Gate to Source Charge (nC) | 9 |
Typical Input Capacitance @ Vds (pF) | 2000@30V |
Typical Output Capacitance (pF) | 490 |
Typical Reverse Recovery Charge (nC) | 28 |
Typical Reverse Recovery Time (ns) | 32 |
Typical Reverse Transfer Capacitance @ Vds (pF) | 22@30V |
Typical Rise Time (ns) | 12 |
Typical Switch Charge (nC) | 9 |
Typical Turn-Off Delay Time (ns) | 20 |
Typical Turn-On Delay Time (ns) | 12 |
Continuous Drain Current (Id) | - |
Drain Source On Resistance (RDS(on)@Vgs,Id) | - |
Drain Source Voltage (Vdss) | - |
Gate Threshold Voltage (Vgs(th)@Id) | - |
Input Capacitance (Ciss@Vds) | - |
Power Dissipation (Pd) | - |
Reverse Transfer Capacitance (Crss@Vds) | - |
Total Gate Charge (Qg@Vgs) | - |
Type | - |
Вес, г | 0.151 |